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For gluing: wood, plywood, chipboard, fiberboard, small fraction panels
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WOOD FIX glue for wood and wood products is developed for gluing all types of wood, as well as performing complex installation. Scope of application: - Construction of houses from glued beams, rounded logs, planed boards, compact blocks. - Construction of frame structures, installation of a box (walls and truss structure). - Installation of roof truss system. - Contour and interior finishing of constructions (clapboard, plywood and other wood materials) - Fixation of wooden caissons. - Veneering and gluing of glued beams. - Fixation of parquet and laminate products (engineering boards, parquet dies up to 40 cm, multi-layer parquet boards)
Characteristics
https://pokupki.market.yandex.ru/product/klei-dlia-drevesiny-i-izdelii-iz-drevesiny-wood-fix/100955128470?show-uid=16194418095035806372206001&offerid=F9XFPSRNCK00jDcRGY8bYA&cpc=v1IV2s3ednTxbW-lp8H34wcneq6ItSC2nHrPA-PNEUGNJKWvW1xFEwtgvQR2cAFBm9VMYJQD0F_KXmGV-FqiLiEvDjZJBp__1KE8lhGgXONjk0oTR-l2wu__NNcGp28hDl73OZHsVajLchN0x6jMWjvmX9HnqLcfksUiNtEqzG0%2C | |
Technical data | ТУ 20.59.59-002-27840515-2019 |
Consistensy | плотная |
Color | белый |
Slice structure | мелкое ячеистое единое покрытие без зазоров, трещин |
Time of solidication | 45 мин. (20°С/отн. влажность 65%) |
Full solidication | 12 часов |
Tensile strength | не менее 0,9 МПа |
Compressive strength at 10% deformation | не менее 0,040 МПа |
Coefficient of thermal conductivity | не более 0,029 Вт/м К |
Apparent density | 17 кг/м³ в пределах |
Adhesion | дерево, шпон, фанера, ДСП, ДВП, панели, МДФ |
Adhesion concrete, brick | 0,7 МПа |
Adhesion wood plywood | 0,75 МПа |
Volume | 1000 ml |
https://www.ozon.ru/product/kley-pena-tris-dlya-dereva-i-izdeliy-iz-drevesiny-vsesezonnaya-1000-ml-181036978/?_bctx=CAQQ2aoE&hs=1 |